LOW TEMPERATURE CURING MULTIPURPOSE SYSTEM
	
	
SP 106 re-engineered
	
	
	
3 : 1 mix ratio by volume
	
	
	
No surface residue, even at +5°C
	
	
	
For bonding, laminating & filling
	
	
	
Available with Fast (F), Slow (SL) & Extra-slow (XS) hardeners